• Ultimate Modularity and Customization Options for AI and HPC Environments
• All-new modular architecture designed for flexibility and future proofing
• Optimal storage, networking, power, and cooling mix for top performance configurations
• Supports all major GPUs and CPUs, maximum CPU and GPU performance configurations, and all major GPU form factors and interfaces
• 10 Gen4 PCIe slots for fast networking devices
• 4U chassis supports up to 10x 2.5” NVMe/SATA drives
• Optional 1U expansion module for improved thermal capacity (up to 700W GPUs) and 2x AIOMs for networking
Key Applications
• AI/ML, Deep Learning Training and Inference
• High-performance Computing (HPC)
• Cloud Computing
• Research Laboratory/National Laboratory
• Autonomous Vehicle Technologies
• Molecular Dynamics Simulation
1.High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio)
2.Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)
3.Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect
4.On board BMC supports integrated
IPMI 2.0 + KVM with dedicated 10G LAN
5.Dual AMD EPYC™ 7003/7002 Series Processors
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
6.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
7.4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP)
8.4 Hot-swap 2.5″ drive bays
(SAS/SATA/NVMe Hybrid)
9.2x 2200W Platinum Level power supplies with Smart Power Redundancy